2

All devices are manufactured and tested on a MIL-

PRF-38534 certified line and are included in the DLA Qual-

ified Manufacturers List, QML-38534 for Hybrid Microcir-

cuits. Each device contains an AlGaAs light emitting diode

optically coupled to a photovoltaic diode stack which

drives two discrete power MOSFETs. The device oper-

ates as a solid-state replacement for single-pole, normally

open, (1 Form A) relay used for general purpose switching

of signals and loads in high reliability applications.

The devices feature logic level input control and very low

output on-resistance, making them suitable for both ac

and dc loads. Connection A, as shown in the Functional

Diagram, allows the device to switch either ac or dc loads.

Connection B, with the polarity and pin configuration as

shown, allows the device to switch dc loads only. The ad-

vantage of Connection B is that the on-resistance is sig-

nificantly reduced, and the output current capability in-

creases by a factor of two.

The devices are convenient replacements for mechanical

and solid state relays where high component reliability

with standard footprint lead configuration is desirable.

Devices may be purchased with a variety of lead bend

and plating options. See Selection Guide table for details.

Standard Microcircuit Drawing (SMD) parts are available

for each package and lead style.

The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E and

SMD 5962-93140 are designed to switch loads on 28 Vdc

power systems. They meet 80 V surge and ± 600 V spike

requirements.

Selection Guide – Lead Configuration Options

Avago Technologies’s Part Number and Options

Commercial

HSSR-7110

MIL-PRF-38534 Class H

HSSR-7111

HSSR-7112

MIL-PRF-38534 Class E

HSSR-711E

Standard Lead Finish

Gold Plate

Gold Plate

Gold Plate

Solder Dipped*

Option #200

Option -200

Option -200

Butt Joint/Gold Plate

Option #100

Option -100

Gull Wing/Soldered*

Option #300

Option -300

Crew Cut/Gold Plate

Option #600

SMD Part Number

Prescript for all below

5962- 5962-

Gold Plate

9314001HPC

9314002HPC

9314001EPC

Solder Dipped*

9314001HPA

9314002HPA

9314001EPA

Butt Joint/Gold Plate

9314001HYC

9314002HYC

Butt Joint/Soldered*

9314001HYA

9314002HYA

Gull Wing/Soldered*

9314001HXA

9314002HXA

Crew Cut/Gold Plate

9314001HZC

Crew Cut/Soldered*

9314001HZA

* Solder Contains Lead

CAUTION: Maximum Switching Frequency – Care should be taken during repetitive switching of loads so as not to exceed the

maximum output current, maximum output power dissipation, maximum case temperature, and maximum junction temperature.