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MM5Z5V6 Datasheet(PDF) 7 Page - PACELEADER INDUSTRIAL |
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MM5Z5V6 Datasheet(HTML) 7 Page - PACELEADER INDUSTRIAL |
7 / 7 page Reel packing COMPONENT INNER REEL CARTON APPROX. PACKAGE REEL SIZE REEL SPACING BOX BOX DIA, SIZE CARTON GROSS WEIGHT (pcs) (m/m) (pcs) (m/m) (m/m) (m/m) (pcs) (kg) SOD-523FL 7" 3,000 4.0 30,000 183*183*123 178 240,000 382*262*387 9.5 Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3 /sec Preheat o -Temperature Min(Tsmin) 150 C o -Temperature Max(Tsmax) 200 C -Time(min to max)(ts) 60~120sec Tsmax to TL o -Ramp-upRate <3 C/sec Time maintained above: o -Temperature(TL) 217 C -Time(tL) 60~260sec o o Peak Temperature(TP) 255 C-0/+5 C o Time within 5 C of actual Peak Temperature(tP) o Ramp-down Rate <6 C/sec o Time 25 C to Peak Temperature <6minutes oC 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55%±25% 2.Reflow soldering of surface-mount devices o o C C Suggested thermal profiles for soldering processes Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat o t25 C to Peak Time 25 TL TP Ramp-down SURFACE MOUNT ZENER DIODES SURFACE MOUNT ZENER DIODES MM5Z2V4 thru MM5Z75V www.paceleader.tw 7 |
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