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THS3111 Datasheet(PDF) 2 Page - Texas Instruments |
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THS3111 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 38 page 1 2 3 4 8 7 6 5 NC VIN − VIN + VS− NC VS+ VOUT NC NC =NoInternalConnection NOTE:Thedevicewiththepower-downoptiondefaultstotheONstateifnosignalisappliedtothePDpin.Additionally,theREFpin functionalrangeisfromV to(V 4V). S S+ - - 1 2 3 4 8 7 6 5 REF VIN− VIN+ VS− VS+ VOUT NC NC=NoInternalConnection PD THS3110 THS3111 D,DGN TOPVIEW D,DGN TOPVIEW THS3110 THS3111 SLOS422E – SEPTEMBER 2003 – REVISED OCTOBER 2009........................................................................................................................................ www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE OPTIONS(1) PACKAGED DEVICE TA PLASTIC SMALL OUTLINE SOIC (D) PLASTIC MSOP (DGN) (2) SYMBOL THS3110CD THS3110CDGN 0°C to +70°C BJB THS3110CDR THS3110CDGNR THS3110ID THS3110IDGN –40°C to +85°C BIR THS3110IDR THS3110IDGNR THS3111CD THS3111CDGN 0°C to +70°C BJA THS3111CDR THS3111CDGNR THS3111ID THS3111IDGN –40°C to +85°C BIS THS3111IDR THS3111IDGNR (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) The PowerPAD is electrically isolated from all other pins. DISSIPATION RATINGS TABLE POWER RATING TJ = +125°C PACKAGE θJC (°C/W) θJA (°C/W) TA = +25°C TA = +85°C D-8(1) 38.3 95 1.05 W 421 mW DGN-8(2) 4.7 58.4 1.71 W 685 mW (1) These data were taken using the JEDEC standard low-K test PCB. For the JEDEC proposed high-K test PCB, the θJA is 95°C/W with power rating at TA = +25°C of 1.05 W. (2) These data were taken using 2 oz. trace and copper pad that is soldered directly to a 3 inch × 3 inch (76,2 mm × 76,2 mm) PCB. For further information, refer to the Application Information section of this data sheet. 2 Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): THS3110 THS3111 |
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