ABSOLUTE MAXIMUM RATINGS

PACKAGE DISSIPATION RATINGS

(1)

RECOMMENDED OPERATING CONDITIONS

THS3201

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Over operating free-air temperature range unless otherwise noted.

(1)

UNIT

Supply voltage

16.5 V

Input voltage

Output current

175 mA

Differential input voltage

±3 V

Continuous power dissipation

See Dissipation Rating Table

+150°C

+125°C

Operating free-air temperature range

–40°C to +85°C

Storage temperature range

–65°C to +150°C

HBM

3000 V

ESD ratings

CDM

1500 V

MM

100 V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may

cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are

stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

(3)

The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may

result in reduced reliability and/or lifetime of the device.

θ

JC

θ

JA

(2)

PACKAGE

(°C/W)

(°C/W)

DBV (5)

55

255.4

391 mW

156 mW

D (8)

38.3

97.5

1.02 W

410 mW

4.7

58.4

1.71 W

685 mW

DGK (8 pin)

54.2

260

385 mW

154 mW

(1)

The THS3201 may incorporate a PowerPAD™ on the underside of the chip. This acts as a heat sink

and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so

may result in exceeding the maximum junction temperature which could permanently damage the

device. See TI technical briefs SLMA002 and SLMA004 for more information about utilizing the

PowerPAD thermally enhanced package.

(2)

This data was taken using the JEDEC standard High-K test PCB.

(3)

Power rating is determined with a junction temperature of +125°C. This is the point where distortion

starts to substantially increase. Thermal management of the final PCB should strive to keep the

junction temperature at or below +125°C for best performance and long term reliability.

MIN

MAX

UNIT

Dual supply

±3.3

±7.5

Supply voltage

V

Single supply

6.6

15

Operating free-air temperature range

–40

+85

°C

2

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