E-pHEMT MMIC

AD211

Korean Facilities : 82-31-250-5078 / rfsales@rfhic.com

All specifications may change without notice

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5 / 6

Version 1.3

Package Dimensions (Type: QFN3x3)

* Unit: mm[inch] | Tolerance: ±0.2[.008]

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Top View

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Side View

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Bottom View

5B

Pin Description

Pin No

Function

Pin No

Function

Pin No

Function

Pin No

Function

1

NC

5

Input Matching

9

NC

13

NC

2

GND

6

NC

10

GND

14

Output-2

3

GND

7

Output-1

11

GND

15

NC

4

Input

8

NC

12

NC

16

NC

6B

* Mounting Configuration Notes

1. Ground / thermal via holes are critical for the proper performance of this device.

2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via hole region contacts the heatsink.

4. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink.

5. RF trace width depends upon the PCB material and construction.

6. Use 1 oz. Copper minimum.