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MPC5607B Datasheet(PDF) 2 Page - Freescale Semiconductor, Inc |
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MPC5607B Datasheet(HTML) 2 Page - Freescale Semiconductor, Inc |
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2 / 112 page  MPC5607B Microcontroller Data Sheet, Rev. 8 Freescale Semiconductor 2 Table of Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 1.1 Document overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 3 Package pinouts and signal descriptions . . . . . . . . . . . . . . . . .8 3.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3.2 . . . . . . . . . . . . Pad configuration during reset phases12 3.3 Pad configuration during standby mode exit . . . . . . . . .13 3.4 Voltage supply pins . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 3.5 Pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 3.6 System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 3.7 Functional port pins . . . . . . . . . . . . . . . . . . . . . . . . . . .15 3.8 Nexus 2+ pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 4.1 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . .35 4.2 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 4.2.1 NVUSRO[PAD3V5V] field description . . . . . . . .35 4.2.2 NVUSRO[OSCILLATOR_MARGIN] field description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 4.2.3 NVUSRO[WATCHDOG_EN] field description . .36 4.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . .36 4.4 Recommended operating conditions . . . . . . . . . . . . . .37 4.5 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . .40 4.5.1 External ballast resistor recommendations . . . .40 4.5.2 Package thermal characteristics . . . . . . . . . . . .40 4.5.3 Power considerations. . . . . . . . . . . . . . . . . . . . .41 4.6 I/O pad electrical characteristics . . . . . . . . . . . . . . . . . .42 4.6.1 I/O pad types . . . . . . . . . . . . . . . . . . . . . . . . . . .42 4.6.2 I/O input DC characteristics . . . . . . . . . . . . . . . .42 4.6.3 I/O output DC characteristics. . . . . . . . . . . . . . .43 4.6.4 Output pin transition times . . . . . . . . . . . . . . . . .46 4.6.5 I/O pad current specification . . . . . . . . . . . . . . .46 4.7 RESET electrical characteristics. . . . . . . . . . . . . . . . . .54 4.8 Power management electrical characteristics . . . . . . . .57 4.8.1 Voltage regulator electrical characteristics . . . .57 4.8.2 Low voltage detector electrical characteristics .59 4.9 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 4.10 Flash memory electrical characteristics . . . . . . . . . . . 62 4.10.1 Program/erase characteristics . . . . . . . . . . . . . 62 4.10.2 Flash power supply DC characteristics . . . . . . 63 4.10.3 Start-up/Switch-off timings . . . . . . . . . . . . . . . . 64 4.11 Electromagnetic compatibility (EMC) characteristics. . 64 4.11.1 Designing hardened software to avoid noise problems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 4.11.2 Electromagnetic interference (EMI) . . . . . . . . . 65 4.11.3 Absolute maximum ratings (electrical sensitivity)65 4.12 Fast external crystal oscillator (4 to 16 MHz) electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 4.13 Slow external crystal oscillator (32 kHz) electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 4.14 FMPLL electrical characteristics . . . . . . . . . . . . . . . . . 71 4.15 Fast internal RC oscillator (16 MHz) electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 4.16 Slow internal RC oscillator (128 kHz) electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 4.17 ADC electrical characteristics . . . . . . . . . . . . . . . . . . . 74 4.17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 4.17.2 Input impedance and ADC accuracy . . . . . . . . 75 4.17.3 ADC electrical characteristics . . . . . . . . . . . . . 80 4.18 On-chip peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 4.18.1 Current consumption . . . . . . . . . . . . . . . . . . . . 85 4.18.2 DSPI characteristics . . . . . . . . . . . . . . . . . . . . . 87 4.18.3 Nexus characteristics . . . . . . . . . . . . . . . . . . . . 93 4.18.4 JTAG characteristics. . . . . . . . . . . . . . . . . . . . . 94 5 Package characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 5.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . 96 5.1.1 176 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 5.1.2 144 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 5.1.3 100 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 5.1.4 208 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . . 105 6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 |
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