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PE9303 Datasheet(PDF) 9 Page - Peregrine Semiconductor Corp. |
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PE9303 Datasheet(HTML) 9 Page - Peregrine Semiconductor Corp. |
9 / 9 page Product Specification PE9303 Page 9 of 9 Document No. 70-0052-02 │ www.psemi.com ©2003-2012 Peregrine Semiconductor Corp. All rights reserved. Table 4. Ordering Information Order Code Description Package Shipping Method 9303-01 PE9303-08CFPJ-B Engineering Samples 8-lead FLAT PACK 50 / Tray 9303-11 PE9303-08CFPJ-B Production Units 8-lead FLAT PACK 50 / Tray 9303-98 Engineering sample die with bonding X (X = A - H) Die 49 units / Waffle Pack 9303-99 Flight die with bonding X (X = A - H) Die 49 units / Waffle Pack 9303-00 PE9303 Evaluation Kit Evaluation Board 1 / Box Advance Information: The product is in a formative or design stage. The datasheet contains design target specifications for product development. Specifications and features may change in any manner without notice. Preliminary Specification: The datasheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification: The datasheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer Notification Form). The information in this datasheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user’s own risk. No patent rights or licenses to any circuits described in this datasheet are implied or granted to any third party. Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, UltraCMOS and UTSi are registered trademarks and HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp. Sales Contact and Information For sales and contact information please visit www.psemi.com. Figure 11. Top Marking Specifications 17-0167 = ESD symbol as well as represents the Pin 1 designation XXXXXXXX = Part number e.g. 20131201 XX = Part number continuation e.g. P1 (same line as datecode) YYWW = Date Code, last two digits of the year and work week ZZZZZZ = Assembly lot number nn = Serial Number |
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