LM48510

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SNAS275D – NOVEMBER 2006 – REVISED OCTOBER 2007

LLP-14 Pin

Name

Function

14

IN-

Amplifier Inverting Input

15

V1

Amplifier Power Input

16

Amplifier Active Low Shutdown

To be soldered to board for enhanced

DAP

thermal dissipation.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (1)

6V

Storage Temperature

−65°C to +150°C

Input Voltage

Internally limited

2000V

200V

Junction Temperature

150°C

Thermal Resistance

37°C/W

See AN-1187 'Leadless Leadframe Packaging (LLP)'

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical

specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the

Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good

indication of device performance.

(2)

lower.

(3)

Human body model, 100pF discharged through a 1.5k

Ω resistor.

(4)

Machine Model, 220pF–240pF discharged through all pins.

Operating Ratings

Temperature Range

2.7V

4.5V

Copyright © 2006–2007, Texas Instruments Incorporated

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