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ADS1220 Datasheet(PDF) 2 Page - Texas Instruments |
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ADS1220 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 57 page  ADS1220 SBAS501A – MAY 2013 – REVISED JULY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. PRODUCT FAMILY MAXIMUM SAMPLE PACKAGE DEVICE RESOLUTION (Bits) MAXIMUM GAIN RATE (SPS) DESIGNATOR QFN-16 ADS1120 16 128 2000 TSSOP-16 QFN-16 ADS1220 24 128 2000 TSSOP-16 ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT MIN MAX AVDD to AVSS –0.3 +7 V DVDD to DGND –0.3 +7 V AVSS to DGND –2.8 +0.3 V Analog input voltage AIN0/REFP1, AIN1, AIN2, AIN3/REFN1, REFP0, REFN0 AVSS – 0.3 AVDD + 0.3 V Digital input voltage CS, SCLK, DIN, DOUT/DRDY, DRDY, CLK DGND – 0.3 DVDD + 0.3 V Momentary –100 +100 mA Analog input current Continuous –10 +10 mA Maximum junction, TJMax +150 °C Temperature Storage, Tstg –60 +150 °C Human body model (HBM) –2000 +2000 V JEDEC standard 22, test method A114-C.01, all pins Electrostatic discharge (ESD) ratings Charged device model (CDM) –500 +500 V JEDEC standard 22, test method C101, all pins (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. THERMAL INFORMATION ADS1220 THERMAL METRIC(1) QFN (RVA) TSSOP (PW) UNITS 16 PINS 16 PINS θJA Junction-to-ambient thermal resistance 43.4 99.5 θJCtop Junction-to-case (top) thermal resistance 47.3 35.2 θJB Junction-to-board thermal resistance 18.4 44.3 °C/W ψJT Junction-to-top characterization parameter 0.6 2.4 ψJB Junction-to-board characterization parameter 18.4 43.8 θJCbot Junction-to-case (bottom) thermal resistance 2.0 n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: ADS1220 |
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