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LM3668 Datasheet(PDF) 4 Page - Texas Instruments |
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LM3668 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 26 page LM3668 SNVS449L – JUNE 2007 – REVISED MARCH 2011 www.ti.com Absolute Maximum Ratings (1) (2) (3) PVIN, VDD Pin, SW1, SW2 & VOUT: Voltage to SGND & PGND −0.2V to +6.0V FB, EN, MODE, and SYNC pins (PGND & SGND-0.2V) to (PVIN + 0.2) PGND to SGND -0.2V to 0.2V Continuous Power Dissipation(4) Internally Limited Maximum Junction Temperature (TJ-MAX) +125°C Storage Temperature Range −65°C to +150°C Maximum Lead Temperature (Soldering, 10 sec) +260°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) The Human body model is a 100pF capacitor discharged through a 1.5 k Ω resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. MIL-STD-883 3015.7 (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). Operating Ratings Input Voltage Range 2.5V to 5.5V Recommended Load Current 0mA to 1A Junction Temperature (TJ) Range −40°C to +125°C Ambient Temperature (TA) Range (1) −40°C to +85°C (1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). Thermal Properties Junction-to-Ambient Thermal Resistance ( θJA) 34°C/W WSON Package(1) (1) Junction-to-ambient thermal resistance ( θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 101.6mm x 76.2mm x 1.6mm. Thickness of the copper layers are 2oz/1oz/1oz/2oz. The middle layer of the board is 60mm x 60mm. Ambient temperature in simulation is 22°C, still air. Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. 4 Submit Documentation Feedback Copyright © 2007–2011, Texas Instruments Incorporated Product Folder Links: LM3668 |
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