TPS62730

SLVSAC3A – MAY 2011 – REVISED MARCH 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

Automatic Bypass Mode Transition

PACKAGE

PART

OUTPUT VOLTAGE

ORDERING

MARKING

hysteresis

TPS62730

2.10

2.25

2.20

50

TPS62730DRY

RP

2.05

2.2

2.15

50

TPS62731DRY

RQ

1.90

2.10

2.05

50

TPS62732DRY

RR

–40°C to

85°C

2.3

2.48

2.41

70

TPS62733DRY

YA

2.10

2.28

2.23

50

TPS62734DRY

SL

2.10

2.33

2.23

100

TPS62735DRY

SM

(1)

The DRY package is available in tape on reel. Add R suffix to order quantities of 3000 parts per reel, T suffix for 250 parts per reel.

(2)

Device status is product preview, contact TI for more details / samples

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN, SW, VOUT

–0.3

4.2

V

ON/BYP, STAT

–0.3

V

Temperature range

–40

125

°C

–65

150

°C

Human Body Model - (HBM)

2

kV

Machine Model (MM)

150

V

Charge Device Model - (CDM)

1

kV

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to network ground terminal.

(3)

ESD testing is performed according to the respective JESD22 JEDEC standard.

THERMAL INFORMATION

DRY / 6 PINS

UNITS

Junction-to-ambient thermal resistance

293.8

Junction-to-case (top) thermal resistance

165.1

Junction-to-board thermal resistance

160.8

°C/W

Junction-to-top characterization parameter

27.3

Junction-to-board characterization parameter

159.6

Junction-to-case (bottom) thermal resistance

65.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

Submit Documentation Feedback

Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s) :TPS62730