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ADS8883IDRCT Datasheet(PDF) 9 Page - Texas Instruments |
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ADS8883IDRCT Datasheet(HTML) 9 Page - Texas Instruments |
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9 / 49 page  1 2 3 4 5 10 9 8 7 6 REF AVDD AINP AINN GND CONVST DOUT SCLK DIN DVDD Thermal PAD 1 2 3 4 5 10 9 8 7 6 REF AVDD AINP AINN GND CONVST DOUT SCLK DIN DVDD ADS8883 www.ti.com SBAS567A – MAY 2013 – REVISED DECEMBER 2013 PIN CONFIGURATIONS DGS PACKAGE DRC PACKAGE VSSOP-10 SON-10 (TOP VIEW, Not to Scale) (TOP VIEW, Not to Scale) PIN ASSIGNMENTS PIN PIN NAME NUMBER FUNCTION DESCRIPTION AINN 4 Analog input Inverting analog signal input AINP 3 Analog input Noninverting analog signal input Analog power supply. AVDD 2 Analog This pin must be decoupled to GND with a 1- μF capacitor. Convert input. CONVST 6 Digital input This pin also functions as the CS input in 3-wire interface mode. Refer to the Description and Timing Characteristics sections for more details. Serial data input. The DIN level at the start of a conversion selects the mode of operation (such as CS DIN 9 Digital input or daisy-chain mode). This pin also serves as the CS input in 4-wire interface mode. Refer to the Description and Timing Characteristics sections for more details. DOUT 7 Digital output Serial data output Digital interface power supply. DVDD 10 Power supply This pin must be decoupled to GND with a 1- μF capacitor. Device ground. Note that this pin is a common ground pin for both the analog power supply (AVDD) GND 5 Analog, digital and digital I/O supply (DVDD). The reference return line is also internally connected to this pin. Positive reference input. REF 1 Analog This pin must be decoupled with a 10- μF or larger capacitor. Clock input for serial interface. SCLK 8 Digital input Data output (on DOUT) are synchronized with this clock. Exposed thermal pad. Thermal pad — Thermal pad Texas Instruments recommends connecting the thermal pad to the printed circuit board (PCB) ground. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: ADS8883 |
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