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ADS8863IDGS Datasheet(PDF) 2 Page - Texas Instruments |
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ADS8863IDGS Datasheet(HTML) 2 Page - Texas Instruments |
2 / 49 page ADS8863 SBAS571A – MAY 2013 – REVISED DECEMBER 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. FAMILY INFORMATION(1) THROUGHPUT 18-BIT, TRUE-DIFFERENTIAL 16-BIT, SINGLE-ENDED 16-BIT, TRUE-DIFFERENTIAL 100 kSPS ADS8887 ADS8866 ADS8867 250 kSPS — — — 400 kSPS ADS8885 ADS8864 ADS8865 500 kSPS — ADS8319(2) ADS8318(2) 680 kSPS ADS8883 ADS8862 ADS8863 1 MSPS ADS8881 ADS8860 ADS8861 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. (2) Pin-to-pin compatible device with AVDD = 5 V. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. VALUE MIN MAX UNIT AINP to GND or AINN to GND –0.3 REF + 0.3 V AVDD to GND or DVDD to GND –0.3 4 V REF to GND –0.3 5.7 V Digital input voltage to GND –0.3 DVDD + 0.3 V Digital output to GND –0.3 DVDD + 0.3 V Operating temperature range, TA –40 +85 °C Storage temperature range, Tstg –65 +150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under electrical characteristics is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION ADS8863 THERMAL METRIC(1) DGS DRC UNITS 10 PINS 10 PINS θJA Junction-to-ambient thermal resistance 151.9 111.1 θJCtop Junction-to-case (top) thermal resistance 45.4 46.4 θJB Junction-to-board thermal resistance 72.2 45.9 °C/W ψJT Junction-to-top characterization parameter 3.3 3.5 ψJB Junction-to-board characterization parameter 70.9 45.5 θJCbot Junction-to-case (bottom) thermal resistance N/A N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: ADS8863 |
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