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ADS7863ARGET Datasheet(PDF) 2 Page - Texas Instruments |
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ADS7863ARGET Datasheet(HTML) 2 Page - Texas Instruments |
2 / 42 page ADS7863A SBAS610 – DECEMBER 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. VALUE UNIT AVDD to AGND –0.3 to +6 V Supply voltage BVDD to BGND –0.3 to +6 V BVDD to AVDD 1.5 × AVDD V Analog and reference input voltage with respect to AGND AGND – 0.3 to AVDD + 0.3 V Digital input voltage with respect to BGND BGND – 0.3 to BVDD + 0.3 V Ground voltage difference |AGND – BGND| 0.3 V Input current to any pin except supply pins –10 to +10 mA Maximum virtual junction temperature, TJ +150 °C Human body model (HBM), JEDEC standard 22, test method ±4000 V A114-C.01, all pins Electrostatic discharge (ESD) ratings Charged device model (CDM), JEDEC standard 22, test method ±1500 V C101, all pins (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range, unless otherwise noted. PARAMETER MIN NOM MAX UNIT AVDD to AGND 2.7 5.0 5.5 V Supply voltage BVDD to BGND, low voltage levels 2.7 3.6 V BVDD to BGND, 5-V logic levels 4.5 5.0 5.5 V Reference input voltage on REFIN 0.5 2.5 2.525 V Analog differential input voltage (CHXX+) – (CHXX–) –VREF +VREF V Operating ambient temperature range, TA –40 +125 °C THERMAL INFORMATION ADS7863A THERMAL METRIC(1) DBQ (SSOP) RGE (QFN) UNITS 24 PINS 24 PINS θJA Junction-to-ambient thermal resistance 80.9 35.0 θJCtop Junction-to-case (top) thermal resistance 44.6 36.1 θJB Junction-to-board thermal resistance 34.2 12.8 °C/W ψJT Junction-to-top characterization parameter 9.2 0.5 ψJB Junction-to-board characterization parameter 33.8 12.8 θJCbot Junction-to-case (bottom) thermal resistance n/a 4.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: ADS7863A |
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