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ADS7863ARGET Datasheet(PDF) 2 Page - Texas Instruments

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Part # ADS7863ARGET
Description  Dual, 2-MSPS, 12-Bit, 2 2 or 3 3 Channel, Simultaneous-Sampling, Analog-to-Digital Converter
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

ADS7863ARGET Datasheet(HTML) 2 Page - Texas Instruments

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ADS7863A
SBAS610 – DECEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
UNIT
AVDD to AGND
–0.3 to +6
V
Supply voltage
BVDD to BGND
–0.3 to +6
V
BVDD to AVDD
1.5 × AVDD
V
Analog and reference input voltage with respect to AGND
AGND – 0.3 to AVDD + 0.3
V
Digital input voltage with respect to BGND
BGND – 0.3 to BVDD + 0.3
V
Ground voltage difference
|AGND – BGND|
0.3
V
Input current to any pin except supply pins
–10 to +10
mA
Maximum virtual junction temperature, TJ
+150
°C
Human body model (HBM),
JEDEC standard 22, test method
±4000
V
A114-C.01, all pins
Electrostatic discharge (ESD) ratings
Charged device model (CDM),
JEDEC standard 22, test method
±1500
V
C101, all pins
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range, unless otherwise noted.
PARAMETER
MIN
NOM
MAX
UNIT
AVDD to AGND
2.7
5.0
5.5
V
Supply voltage
BVDD to BGND, low voltage levels
2.7
3.6
V
BVDD to BGND, 5-V logic levels
4.5
5.0
5.5
V
Reference input voltage on REFIN
0.5
2.5
2.525
V
Analog differential input voltage
(CHXX+) – (CHXX–)
–VREF
+VREF
V
Operating ambient temperature range, TA
–40
+125
°C
THERMAL INFORMATION
ADS7863A
THERMAL METRIC(1)
DBQ (SSOP)
RGE (QFN)
UNITS
24 PINS
24 PINS
θJA
Junction-to-ambient thermal resistance
80.9
35.0
θJCtop
Junction-to-case (top) thermal resistance
44.6
36.1
θJB
Junction-to-board thermal resistance
34.2
12.8
°C/W
ψJT
Junction-to-top characterization parameter
9.2
0.5
ψJB
Junction-to-board characterization parameter
33.8
12.8
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
4.1
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: ADS7863A


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