F1772 X2

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Vishay Roederstein

Revision: 15-Apr-14

5

Document Number: 28161

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

MOUNTING

Normal Use

The capacitors are designed for mounting on printed-circuit boards. The capacitors packed in bandoliers are designed for

mounting in printed-circuit boards by means of automatic insertion machines.



Specific Method of Mounting to Withstand Vibration and Shock

In order to withstand vibration and shock tests, it must be ensured that stand-off pips are in good contact with the printed-circuit

board:

• For pitches

 15 mm capacitors shall be mechanically fixed by the leads

• For larger pitches the capacitors shall be mounted in the same way and the body clamped

Space Requirements on Printed Circuit Board

board is shown in the drawings.

• For products with pitch

 15 mm, w = l = 0.3 mm; h = 0.1 mm

• For products with 15 mm < pitch

 27.5 mm, w = l = 0.5 mm; h = 0.1 mm

• For products with pitch = 37.5 mm,

w = l = 0.7 mm; h = 0.5 mm

Eccentricity defined as in drawing. The maximum eccentricity is smaller than or equal to the lead diameter of the product

concerned.

SOLDERING CONDITIONS

For general soldering conditions and wave soldering profile, we refer to the application note: “Soldering Guidelines for Film

Storage Temperature

Ratings and Characteristics Reference Conditions

Unless otherwise specified, all electrical values apply to an ambient temperature of 23 °C ± 1 °C, an atmospheric pressure of

86 kPa to 106 kPa and a relative humidity of 50 % ± 2 %.

For reference testing, a conditioning period shall be applied over 96 h ± 4 h by heating the products in a circulating air oven at

the rated temperature and a relative humidity not exceeding 20 %.

CBA116

Eccentricity

w

h

I

Seating plane