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LM2903QDGKRQ1 Datasheet(PDF) 3 Page - Texas Instruments

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Part # LM2903QDGKRQ1
Description  LM2903-Q1 Dual Differential Comparators
Download  18 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM2903QDGKRQ1 Datasheet(HTML) 3 Page - Texas Instruments

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1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
GND
VCC
2OUT
2IN−
2IN+
LM2903-Q1
www.ti.com
SLCS141E – MAY 2003 – REVISED JULY 2014
6 Pin Configuration and Functions
D, DGK OR PW PACKAGE
Top View
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
1OUT
1
Output
Comparator 1's output pin
1IN-
2
Input
Comparator 1's negative input pin
1IN+
3
Input
Comparator 1's positive input pin
GND
4
Input
Ground
2IN+
5
Input
Comparator 2's positive input pin
2IN-
6
Input
Comparator 2's negative input pin
2OUT
7
Output
Comparator 2's output pin
VCC
8
Input
Supply Pin
7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage(2)
36
V
VID
Differential input voltage(3)
–36
36
V
VI
Input voltage range (either input)
−0.3
36
V
VO
Output voltage
36
V
IO
Output current
20
mA
Duration of output short-circuit to ground
Unlimited
D package
97
°C/W
θJA
Package thermal impedance(4)
PW package
149
°C/W
DGK package
199.4
°C/W
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values, except differential voltages, are with respect to GND.
(3)
Differential voltages are at IN+ with respect to IN
−.
(4)
The package thermal impedance is calculated in accordance with JESD 51-7.
7.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per AEC Q100-002(1)
0
1000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per
All pins
0
750
AEC Q100-011
(1)
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
Copyright © 2003–2014, Texas Instruments Incorporated
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