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GL34G Datasheet(PDF) 1 Page - General Semiconductor |
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GL34G Datasheet(HTML) 1 Page - General Semiconductor |
1 / 2 page GL34A THRU GL34J SURFACE MOUNT GLASS PASSIVATED FAST SWITCHING JUNCTION RECTIFIER Reverse Voltage - 50 to 600 Volts Forward Current - 0.5 Ampere FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ For surface mount applications ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ Fast switching for high efficiency ♦ High temperature soldering guaranteed: 450°C/5 seconds at terminals. Complete device submersible temperature of 260°C for 10 seconds in solder bath MECHANICAL DATA Case: JEDEC DO-213AA molded plastic over glass body Terminals: Plated terminals, solderable per MIL-STD-750, Method 2026 Polarity: Two bands indicate cathode-end - 1st band denotes device type and 2nd band denotes repetitive peak reverse voltage rating Mounting Position: Any Weight: 0.0014 ounce, 0.036 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. Standard recovery device: first band is white SYMBOLS GL34A GL34B GL34D GL34G GL34J Polarity color bands (2nd Band) Gray Red Orange Yellow Green Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 Volts Maximum RMS voltage VRMS 35 70 140 280 420 Volts Maximum DC blocking voltage VDC 50 100 200 400 600 Volts Maximum average forward rectified current at TT=75°C I(AV) 0.5 Amp Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 10.0 Amps Maximum instantaneous forward voltage at 0.5A VF 1.2 1.3 Volts Maximum DC reverse current TA=25°C 5.0 at rated DC blocking voltage TA=125°C IR 50.0 µA Maximum full load reverse current, full cycle average at TA=55°C IR(AV) 30.0 µA Typical reverse recovery time (NOTE 1) trr 1.5 µs Typical junction capacitance (NOTE 2) CJ 4.0 pF Maximum thermal resistance (NOTE 3) R ΘJA 150.0 (NOTE 4) R ΘJT 70.0 °C/W Operating junction and storage temperature range TJ, TSTG -65 to +175 °C NOTES: (1) Reverse recovery test conditions IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient, 0.2 x 0.2” (5.0 x 5.0mm) copper pads to each terminal (4) Thermal resistance from junction to terminal, 0.2 x 0.2” (5.0 x 5.0mm) copper pads to each terminal 4/98 SOLDERABLE ENDS 1st BAND 2nd BAND 0.022 (0.559) 0.016 (0.406) 0.145 (3.683) 0.131(3.327) D1= 0.066 0.060 (1.676) (1.524) D2 = D1 + 0 - 0.008 (0.20) 1st band denotes type and polarity 2cnd band denotes voltage type D2 DO-213AA ® Dimensions in inches and (millimeters) *Glass-plastic encapsulation technique is covered by Patent No. 3,996,602 and brazed-end cap assembly by Patent No. 3,930,306 |
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