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MB2M Datasheet(PDF) 1 Page - General Semiconductor |
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MB2M Datasheet(HTML) 1 Page - General Semiconductor |
1 / 2 page MB2M THRU MB6M MINIATURE GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER Reverse Voltage - 200 to 600 Volts Forward Current - 0.5 Ampere FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ This series is UL recognized under Component Index, file number E54214 ♦ Glass passivated chip junctions ♦ High surge overload rating: 35A peak ♦ Saves space on printed circuit board ♦ High temperature soldering guaranteed: 260°C/10 seconds, at 5 lbs. (2.3kg) tension MECHANICAL DATA Case: Molded plastic body over passivated junctions Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Polarity symbols marked on body Mounting Position: Any Weight: 0.078 ounce, 0.22 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS MB2M MB4M MB6M UNITS Device marking code 2 4 6 Maximum repetitive peak reverse voltage VRRM 200 400 600 Volts Maximum RMS voltage VRMS 140 280 420 Volts Maximum DC blocking voltage VDC 200 400 600 Volts Maximum average forward output rectified current at TA=30°C - on glass-epoxy P.C.B. (NOTE 1) I(AV) 0.5 Amp on aluminum substrate (NOTE 2) 0.8 Peak forward surge current 8.3msec. single half sine- wave superimposed on rated load (JEDEC Method) IFSM 35.0 Amps Rating for fusing (t<8.3ms) I2t 5.0 A 2sec Maximum instantaneous forward voltage drop per leg at 0.4A VF 1.0 Volts Maximum DC reverse current at TA=25°C 5.0 µA rated DC blocking voltage per leg TA=125°C IR 500 Typical junction capacitance per leg (NOTE 3) CJ 13.0 pF Typical thermal resistance per leg (NOTE 1) R ΘJL 20.0 (NOTE 1) R ΘJA 85.0 °C/W (NOTE 2) R ΘJA 70.0 Operating junction and storage temperature range TJ, TSTG -55 to +150 °C NOTES: (1) On glass epoxy P.C.B. mounted on 0.05 x 0.05” (1.3 x 1.3mm) solder pads (2) On aluminum substrate P.C.B. with an area of 0.8 x 0.8 x 0.25” (20 x 20 x 6.4mm) mounted on 0.05 x 0.05” (1.3 x1.3mm) solder pad (3) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts 0.147 (3.73) 0.137 (3.48) 0.144 (3.65) 0.161 (4.10) 0.106 (2.70) 0.090 (2.30) 0.190 (4.83) 0.179 (4.55) 0.029 (0.74) 0.017 (0.43) 0.012 (0.30) 0.008 (0.20) 0.105 (2.67) 0.095 (2.41) 0.047 (1.19) 0.038 (0.96) 0.205 (5.21) 0.195 (4.95) 0-10 ° 0.117 (2.97) 0.107 (2.72) 0.028 (0.71) 0.020 (0.51) 0.016(0.41) 0.006 (0.15) 0.100 (2.54) MIN. 0.049 (1.24) 0.039 (0.99) Case Style MBM Dimensions in inches and (millimeters) PATENT PENDING PATENT PENDING PATENT PENDING |
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