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ADC12DL040 Datasheet(PDF) 5 Page - Texas Instruments

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Part # ADC12DL040
Description  ADC12DL040 Dual 12-Bit, 40 MSPS, 3V, 210mW A/D Converter
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

ADC12DL040 Datasheet(HTML) 5 Page - Texas Instruments

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VDR
DR GND
AGND
VA
VD
DGND
AGND
VA
VD
DGND
AGND
VA
ADC12DL040
www.ti.com
SNAS250D – FEBRUARY 2005 – REVISED APRIL 2013
Pin No.
Symbol
Equivalent Circuit
Description
DIGITAL I/O
Digital clock input. The range of frequencies for this input is as
60
CLK
specified in the electrical tables with ensured performance at 40
MHz. The input is sampled on the rising edge.
OEA and OEB are the output enable pins that, when low, holds their
respective data output pins in the active state. When either of these
pins is high, the corresponding outputs are in a high impedance
state.
22
OEA
41
OEB
PD is the Power Down input pin. When high, this input puts the
59
PD
converter into the power down mode. When this pin is low, the
converter is in the active mode.
When low, "A" and "B" data is present on it's respective data output
lines (Parallel Mode).
When high, both "A" and "B" channel data is present on the
"DA0:DA11" digital outputs (Multiplex Mode). The DB0/ABb pin is
used to synchronize the data.
11
MULTIPLEX
24–29
Digital data output pins that make up the 12-bit conversion results of
DA0–DA11
34–39
their respective converters. DA0 and DB0 are the LSBs, while DA11
and DB11 are the MSBs of the output word. Output levels are
43–47
DB1–DB11
TTL/CMOS compatible. Optimum loading is < 10pF.
52–57
When MULTIPLEX is low, this is DB0.
When MULTIPLEX is high this is the ABb signal, which is used to
42
DB0/ABb
synchronize the multiplexed data. ABb changes synchronously with
the Multiplexed "A" and "B" channels. ABb is "high" when "A"
channel data is valid and is "low" when "B" channel data is valid.
ANALOG POWER
Positive analog supply pins. These pins should be connected to a
9, 18, 19, 62,
VA
quiet +3.0V source and bypassed to AGND with 0.1 µF capacitors
63
located within 1 cm of these power pins, and with a 10 µF capacitor.
3, 8, 10, 17,
AGND
The ground return for the analog supply.
20, 61, 64
DIGITAL POWER
Positive digital supply pin. This pin should be connected to the same
quiet +3.0V source as is VA and be bypassed to DGND with a 0.1 µF
33, 48
VD
capacitor located within 1 cm of the power pin and with a 10 µF
capacitor.
32, 49
DGND
The ground return for the digital supply.
Positive driver supply pin for the ADC12DL040's output drivers. This
pin should be connected to a voltage source of +2.4V to VD and be
bypassed to DR GND with a 0.1 µF capacitor. If the supply for this
30, 51
VDR
pin is different from the supply used for VA and VD, it should also be
bypassed with a 10 µF capacitor. VDR should never exceed the
voltage on VD. All 0.1 µF bypass capacitors should be located within
1 cm of the supply pin.
The ground return for the digital supply for the ADC12DL040's output
drivers. These pins should be connected to the system digital
23, 31, 40,
DR GND
ground, but not be connected in close proximity to the
50, 58
ADC12DL040's DGND or AGND pins. See LAYOUT AND
GROUNDING for more details.
Copyright © 2005–2013, Texas Instruments Incorporated
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