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LM12454 Datasheet(PDF) 4 Page - Texas Instruments

Part # LM12454
Description  LM12454/LM12458/LM12H458 12-Bit Sign Data Acquisition System with Self-Calibration
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM12454 Datasheet(HTML) 4 Page - Texas Instruments

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LM12454, LM12458, LM12H458
SNAS079A – MAY 2004 – REVISED FEBRUARY 2006
www.ti.com
Absolute Maximum Ratings
(1) (2)
Supply Voltage (VA+ and VD+)
6.0V
Voltage at Input and Output Pins, except analog inputs
−0.3V to (V+ + 0.3V)
Voltage at Analog Inputs
− 5V to (V+ + 5V)
|VA+ − VD+|
300 mV
Input Current at Any Pin (3)
±5 mA
Package Input Current (3)
±20 mA
Power Dissipation, PQFP
(TA = 25°C)
(4)
875 mW
Storage Temperature
−65°C to +150°C
Lead Temperature
PQFP, Infrared, 15 sec.
+300°C
PLCC, Solder, 10 sec.
+250°C
ESD Susceptibility (5)
1.5 kV
(1)
All voltages are measured with respect to GND, unless otherwise specified.
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
(3)
When the input voltage (VIN) at any pin exceeds the power supply rails (VIN < GND or VIN > (VA+ or VD+)), the current at that pin should
be limited to 5 mA. The 20 mA maximum package input current rating allows the voltage at any four pins, with an input current of 5 mA,
to simultaneously exceed the power supply voltages.
(4)
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA (ambient temperature).
(5)
Human body model, 100 pF discharged through a 1.5 k
Ω resistor.
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering
surface mount devices.
Table 2. Package Thermal Resistances
Package
θJA
44-Lead PQFP
47°C / W
44-Lead PLCC
50°C / W
Operating Ratings
(1) (2)
Temperature Range
(Tmin ≤ TA ≤ Tmax)
−40°C ≤ TA ≤ 85°C
Supply Voltage
VA+, VD+
3.0V to 5.5V
|VA+ − VD+|
≤100 mV
VIN+ Input Range
GND
≤ VIN+ ≤ VA+
VIN− Input Range
GND
≤ VIN− ≤ VA+
VREF+ Input Voltage
1V
≤ VREF+ ≤ VA+
VREF− Input Voltage
0V
≤ VREF− ≤ VREF+ − 1V
VREF+ − VREF−
1V
≤ VREF ≤ VA+
VREF Common Mode
Range (3)
0.1 VA
+ ≤ V
REFCM ≤ 0.6 VA
+
TJ(MAX)
150°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
(2)
All voltages are measured with respect to GND, unless otherwise specified.
(3)
VREFCM (Reference Voltage Common Mode Range) is defined as (VREF+ + VREF−)/2.
4
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Copyright © 2004–2006, Texas Instruments Incorporated
Product Folder Links: LM12454 LM12458 LM12H458


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