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Data Sheet

SML-P1 series

lAttention Points In Handling

This product was developed as a surface mount LED especially suitable for reflow soldering.

Please take care of following points when using this device.

1.DESIGNING OF PCB

As for a recommendable solder pattern, Please refer to Fig ”Recommended Solder Pattern”.

The size and direction of the pad pattern depend on the condition of the PCB.

This product of structured with rear/bottom electrode to be soldered.

The formation of solder fillet is not guaranteed due to its electrode shape

Additional notification of mounting :

We recommend additional facility of mounting Machine due to small size package

which might be haven electrification, and product might be moved in the taping pocket.

And the mounting production efficiency will be decreased.

Ex) Magnet facility etc.

2.SOLDERING (Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu)

LED products do not contain reinforcement

materials such as glass fillers.

Therefore, thermal stress by soldering greatly

influences its reliability.

The temperature conditions for reflow soldering

should therefore be set up according to the

characteristic of this product. (See Fig-1)

Number of reflow process shall be max 2 times

and these processes shall be performed in a row.

Cooling process to normal temperature shall be required

between the first and the second soldering process.

SOLDERING OPERATION

1) SOLDER USED

Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu

2) SOLDERING CONDITION

LED products do not contain reinforcement material such as a glass fillers.

So thermal stress by soldering greatly influence its reliability.

Please keep following points for manual soldering.

a)

Less than 30W, top of iron less than 3mm.

Condition) Temp. of iron top less than

400ºC within 3 sec.

Heating on PCB pattern, not direct to the LED. (Fig-2)

Please handle after the part temp.

Goes down to room temp.

3.HANDLING AFTER MOUNTING (Fig.-3)

As shown in the drawing on the right, in case outside force of about 700g is given to the device, stress is concentrated

to the jointed part between mold resin and substrate.

Therefore there is a possibility to breath the device or PCB.

Careful handing is needed as ROHM cannot guarantee the falling of the device by outside force after mounting.

Handling after soldering

c)

RECOMMENDED CONDITION

ITEM

Soldering iron

b)

Heating method

SOLDERING

IRON

SOLDERING

LAND

(Fig-2)

0

50

100

150

200

250

300

Mask open area ratio：80%

Mask thickness ：80 to 100

mm

Reference

Min.1 min

Max.

Max.260ºC, Within

140 to 180ºC

230 to 260ºC

(Fig-1)

9/10

2014.07 - Rev.E