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ICS557-01 Datasheet(PDF) 7 Page - Integrated Device Technology

Part # ICS557-01
Description  PCI-EXPRESS GEN1 CLOCK SOURCE
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

ICS557-01 Datasheet(HTML) 7 Page - Integrated Device Technology

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ICS557-01
PCI-EXPRESS GEN1 CLOCK SOURCE
PCIE
IDT® PCI-EXPRESS GEN1 CLOCK SOURCE
7
ICS557-01
REV P 072512
AC Electrical Characteristics - CLK/CLK
Unless stated otherwise, VDD=3.3 V ±5%, Ambient Temperature -40 to +85
° C
1 Test setup is R
L=50 ohms with 2 pF, RR = 475Ω (1%).
2 Measurement taken from a single-ended waveform.
3 Measurement taken from a differential waveform.
4 Measured at the crossing point where instantaneous voltages of both CLKOUT and CLKOUT are equal.
5 CLKOUT pins are tri-stated when OE is low asserted. CLKOUT is driven differential when OE is high.
Thermal Characteristics (8-pin SOIC)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
25
MHz
Output Frequency
100
MHz
Output High Voltage1,2
VOH
660
700
850
mV
Output Low Voltage1,2
VOL
-150
0
27
mV
Crossing Point
Voltage1,2
Absolute
250
350
550
mV
Crossing Point
Voltage1,2,4
Variation over all edges
140
mV
Jitter, Cycle-to-Cycle1,3
80
ps
Rise Time1,2
tOR
From 0.175 V to 0.525 V
175
332
700
ps
Fall Time1,2
tOF
From 0.525 V to 0.175 V
175
344
700
ps
Rise/Fall Time
Variation1,2
125
ps
Duty Cycle1,3
45
55
%
Output Enable Time5
All outputs
30
µs
Output Disable Time5
All outputs
30
µs
Stabilization Time
tSTABLE
From power-up VDD=3.3 V
3.0
ms
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Thermal Resistance Junction to
Ambient
θJA
Still air
150
° C/W
θJA
1 m/s air flow
140
° C/W
θJA
3 m/s air flow
120
° C/W
Thermal Resistance Junction to Case
θJC
40
° C/W


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