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BAS16DW Datasheet(PDF) 1 Page - Diotec Semiconductor |
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BAS16DW Datasheet(HTML) 1 Page - Diotec Semiconductor |
1 / 2 page BAS16DW BAS16DW Fast Switching Surface Mount Si-Planar Diodes Schnelle Si-Planar-Dioden für die Oberflächenmontage Version 2014-08-19 Dimensions - Maße [mm] Power dissipation – Verlustleistung 200 mW Repetitive peak reverse voltage Periodische Spitzensperrspannung 100 V Plastic case – Kunststoffgehäuse SOT-363 Weight approx. – Gewicht ca. 0.01 g Plastic material has UL classification 94V-0 Gehäusematerial UL94V-0 klassifiziert Standard packaging taped and reeled Standard Lieferform gegurtet auf Rolle Maximum ratings (TA = 25°C) Grenzwerte (TA = 25°C) BAS16DW Power dissipation − Verlustleistung Ptot 200 mW 1) Max. average forward current – Dauergrenzstrom (dc) IFAV 200 mA 1) Non repetitive peak forward surge current Stoßstrom-Grenzwert tp ≤ 1 s tp ≤ 1 µs IFSM IFSM 1 A 2 A Repetitive peak reverse voltage – Periodische Spitzensperrspannung VRRM 100 V Junction temperature – Sperrschichttemperatur Storage temperature – Lagerungstemperatur Tj TS -55...+150°C -55…+150°C Characteristics (Tj = 25°C) Kennwerte (Tj = 25°C) Forward voltage 2) Durchlass-Spannung 2) IF = 1 mA IF = 10 mA IF = 50 mA IF = 150 mA VF VF VF VF < 715 mV < 855 mV < 1.0 V < 1.25 V Leakage current Sperrstrom Tj = 25°C VR = 75 V IR < 1 µA Tj = 150°C Tj = 150°C VR = 25 V VR = 75 V IR IR < 30 µA < 50 µA Max. junction capacitance – Max. Sperrschichtkapazität VR = 0 V, f = 1 MHz CT 2 pF Reverse recovery time – Sperrverzug IF = 10 mA über/through IR = 10 mA bis/to IR = 1 mA trr < 4 ns Thermal resistance junction to ambient air Wärmewiderstand Sperrschicht – umgebende Luft RthA < 620 K/W 1) 1 Mounted on P.C. board with 3 mm2 copper pad at each terminal Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss 2 Tested with pulses tp = 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2% © Diotec Semiconductor AG http://www.diotec.com/ 1 2.4 2 x 0.65 5 6 4 0.9±0.1 2 ±0.1 Type Code 3 2 1 |
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