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HT827A0 Datasheet(PDF) 3 Page - Holtek Semiconductor Inc |
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HT827A0 Datasheet(HTML) 3 Page - Holtek Semiconductor Inc |
3 / 49 page Pad Assignment Chip size: 3555 ´ 5015 (mm) 2 * The IC substrate should be connected to VSS in the PCB layout artwork. * The TMR pad must be bound to VDD or VSS if it is not used. HT827A0 3 March 15, 2000 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 PB 3 PB 2 PB 1 PB 0 VS S PE 0 PE 1 PE 2 PE 3 IN T TM R OS C 2 OS C 1 VD D RE S AU D (0 , 0 ) |
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