HCPL-6530 datasheet(3/12 Pages) HP

Part #	HCPL-6530

Description	Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications

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Manufacturer	HP [Agilent(Hewlett-Packard)]

Direct Link	http://www.home.agilent.com

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3 / 12 page

1-561

0.20 (0.008)

0.33 (0.013)

4.45 (0.175)

MAX.

20.06 (0.790)

20.83 (0.820)

0.51 (0.020)

MAX.

2.29 (0.090)

2.79 (0.110)

0.51 (0.020)

MIN.

0.89 (0.035)

1.65 (0.065)

8.13 (0.320)

MAX.

7.36 (0.290)

7.87 (0.310)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

3.81 (0.150)

MIN.

Functional Diagrams

16 Pin DIP

8 Pin DIP

16 Pin Flat Pack

20 Pad LCCC

Through Hole

Unformed Leads

Surface Mount

2 Channels

1 Channel

2 Channels

4 Channels

2 Channels

Note: 8 pin DIP and flat pack devices have common VCC and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages

have isolated channels with separate VCC and ground connections.

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

HP QYYWWZ

XXXXXX

* XXXX

XXXXXX

USA 50434

DESC SMD*

HP FSCN*

HP LOGO

COUNTRY OF MFR.

HP P/N

PIN ONE/

ESD IDENT

DESC SMD*

*QUALIFIED PARTS ONLY

Leaded Device Marking

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

HP QYYWWZ

XXXXXX

XXXXXXX

XXX USA

* 50434

COUNTRY OF MFR.

HP FSCN*

HP LOGO

DESC SMD*

PIN ONE/

ESD IDENT

HP P/N

DESC SMD*

* QUALIFIED PARTS ONLY

Leadless Device Marking

5

7

6

8

12

10

11

9

GND

VCC2

VB2

1

3

2

4

16

14

15

13

VOC1

GND

VO1

VO2

VB1

1

3

2

4

8

6

7

5

VCC

GND

VOUT

VB

1

3

2

4

8

6

7

5

VCC

GND

VO2

VO1

5

7

6

8

12

10

11

9

GND

VO4

VO3

1

3

2

4

16

14

15

13

VCC

VO2

VO1

Outline Drawings

16 Pin DIP Through Hole, 2 Channels

GND1

VB2

19

20

2

3

VO1

8

7

VCC2

VCC1

10

GND2

15

13

12

14

VO2

VB1 9

*QUALIFIED PARTS ONLY

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HCPL-6530 Datasheet(PDF) 3 Page - Agilent(Hewlett-Packard)

HCPL-6530 Datasheet(HTML) 3 Page - Agilent(Hewlett-Packard)

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