8XC196NT

272267– 1

Figure 1 8XC196NT Block Diagram

PROCESS INFORMATION

This device is manufactured on P6295 a CHMOS

III-E process Additional process and reliability infor-

mation is available

in the Intel®

Quality System

Table 1 Thermal Characteristics

Package

Type

PLCC

365 CW

13 CW

All thermal impedance data is approximate for static

air conditions at 1W of power dissipation Values will

change depending on operation conditions and ap-

plication See the Intel

number 240800) for a description of Intel’s thermal

impedance test methodology

272267 – 2

EXAMPLE

N87C196NT is 68-Lead PLCC OTPROM

For complete package dimensional data refer to the Intel Packaging Handbook (Order Number 240800)

Figure 2 The 8XC186NT Familiy Nomenclature

2