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IDT70261S35PFI Datasheet(PDF) 9 Page - Integrated Device Technology |
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IDT70261S35PFI Datasheet(HTML) 9 Page - Integrated Device Technology |
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9 / 19 page  6.42 IDT70261S/L High-Speed 16K x 16 Dual-Port Static RAM with Interrupt Industrial and Commercial Temperature Ranges 9 Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(1,5,8) NOTES: 1. R/ W or CE or UB and LB = VIH during all address transitions. 2. A write occurs during the overlap (tEW or tWP) of a CE = VIL and a R/W = VIL for memory array writing cycle. 3. tWR is measured from the earlier of CE or R/W (or SEM or R/W) going VIH to the end of write cycle. 4. During this period, the I/O pins are in the output state and input signals must not be applied. 5. If the CE or SEM = VIL transition occurs simultaneously with or after the R/W = VIL transition, the outputs remain in the High-impedance state. 6. Timing depends on which enable signal is asserted last, CE or R/W. 7. This parameter is guaranteed by device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test Load (Figure 2). 8. If OE = VIL during R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off and data to be placed on the bus for the required tDW. If OE = VIH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified tWP. 9. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. tEW must be met for either condition. Timing Waveform of Write Cycle No. 2, CE, UB, LB Controlled Timing(1,5) R/ W tWC tHZ tAW tWR tAS tWP DATAOUT (2) tWZ tDW tDH tOW OE ADDRESS DATAIN (6) (4) (4) (7) UB or LB 3039 drw 07 (9) CE or SEM (9) (7) (3) 3039 drw 08 tWC tAS tWR tDW tDH ADDRESS DATAIN R/ W tAW tEW UB or LB (3) (2) (6) CE or SEM (9) (9) |
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