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FDG6301N_F085 Datasheet(PDF) 2 Page - Fairchild Semiconductor |
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FDG6301N_F085 Datasheet(HTML) 2 Page - Fairchild Semiconductor |
2 / 5 page Electrical Characteristics (T A = 25 OC unless otherwise noted ) Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS BV DSS Drain-Source Breakdown Voltage V GS = 0 V, ID = 250 µA 25 V ∆BV DSS/∆TJ Breakdown Voltage Temp. Coefficient I D = 250 µA, Referenced to 25 o C 25 mV /oC I DSS Zero Gate Voltage Drain Current V DS = 20 V, VGS = 0 V 1 µA T J = 55°C 10 µA I GSS Gate - Body Leakage Current V GS = 8 V, VDS = 0 V 100 nA ON CHARACTERISTICS (Note 2) V GS(th) Gate Threshold Voltage V DS = VGS, ID = 250 µA 0.65 0.85 1.5 V ∆V GS(th)/∆TJ Gate Threshold Voltage Temp.Coefficient I D = 250 µA, Referenced to 25 o C -2.1 mV /oC R DS(ON) Static Drain-Source On-Resistance V GS = 4.5 V, ID = 0.22 A 2.6 4 Ω T J =125°C 5.3 7 V GS = 2.7 V, ID = 0.19 A 3.7 5 I D(ON) On-State Drain Current V GS = 4.5 V, VDS = 5 V 0.22 A g FS Forward Transconductance V DS = 5 V, ID= 0.22 A 0.2 S DYNAMIC CHARACTERISTICS C iss Input Capacitance V DS = 10 V, VGS = 0 V, f = 1.0 MHz 9.5 pF C oss Output Capacitance 6 pF C rss Reverse Transfer Capacitance 1.3 pF SWITCHING CHARACTERISTICS (Note 2) t D(on) Turn - On Delay Time V DD = 5 V, ID = 0.5 A, V GS = 4.5 V, RGEN = 50 Ω 5 10 ns t r Turn - On Rise Time 4.5 10 ns t D(off) Turn - Off Delay Time 4 8 ns t f Turn - Off Fall Time 3.2 7 ns Q g Total Gate Charge V DS = 5 V, ID = 0.22 A, V GS = 4.5 V 0.29 0.4 nC Q gs Gate-Source Charge 0.12 nC Q gd Gate-Drain Charge 0.03 nC DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS I S Maximum Continuous Source Current 0.25 A V SD Drain-Source Diode Forward Voltage V GS = 0 V, IS = 0.25 A (Note 2) 0.8 1.2 V Notes: 1. R θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while R θCA is determined by the user's board design. RθJA = 415 OC/W on minimum pad mounting on FR-4 board in still air. 2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%. FDG6301N_F085 Rev. A www.fairchildsemi.com 2 |
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