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IDT7164L20TP Datasheet(PDF) 5 Page - Integrated Device Technology

Part # IDT7164L20TP
Description  CMOS STATIC RAM 64K (8K x 8-BIT)
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

IDT7164L20TP Datasheet(HTML) 5 Page - Integrated Device Technology

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6.1
5
IDT7164S/L
CMOS STATIC RAM 64K (8K x 8-BIT)
MILITARY AND COMMERCIAL TEMPERATURE RANGES
AC ELECTRICAL CHARACTERISTICS (VCC = 5.0V
± 10%, All Temperature Ranges)
7164S15
(1)
7164S20
7164S25
7164S30
(2)
7164L15
(1)
7164L20
7164L25
7164L30
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
Read Cycle
tRC
Read Cycle Time
15
20
25
30
ns
tAA
Address Access Time
15
19
25
29
ns
tACS1
(3)
Chip Select-1 Access Tim
15
20
25
30
ns
tACS2
(3)
Chip Select-2 Access Time
20
25
30
35
ns
tCLZ1,2
(4) Chip Select-1, 2 to Output in Low-Z
5
5
5
5
ns
tOE
Output Enable to Output Valid
7
8
12
15
ns
tOLZ
(4)
Output Enable to Output in Low-Z
0
0
0
0
ns
tCHZ1,2
(4) Chip Select-1, 2 to Output in High-Z
8
9
13
13
ns
tOHZ
(4)
Output Disable to Output in High-Z
7
8
10
12
ns
tOH
Output Hold from Address Change
5
5
5
5
ns
tPU
(4)
Chip Select to Power Up Time
0
0
0
0
ns
tPD
(4)
Chip Deselect to Power Down Time
15
20
25
30
ns
Write Cycle
tWC
Write Cycle Time
15
20
25
30
ns
tCW1, 2
Chip Select to End-of-Write
14
15
18
22
ns
tAW
Address Valid to End-of-Write
14
15
18
22
ns
tAS
Address Set-up Time
0
0
0
0
ns
tWP
Write Pulse Width
14
15
21
23
ns
tWR1
Write Recovery Time (
CS1, WE)
0
—0
—0
0
ns
tWR2
Write Recovery Time (CS2)
5
—5
—5
5
ns
tWHZ
(4)
Write Enable to Output in High-Z
6
8
10
12
ns
tDW
Data to Write Time Overlap
8
10
13
13
ns
tDH1
Data Hold from Write Time (
CS1, WE)
0
—0
—0
0
ns
tDH2
Data Hold from Write Time (CS2)
5
—5
—5
5
ns
tOW
(4)
Output Active from End-of-Write
4
4
4
4
ns
NOTES:
2967 tbl 11
1. 0
° to +70°C temperature range only.
2. –55
°C to +125°C temperature range only. Also available: 100ns military devices.
3. Both chip selects must be active for the device to be selected.
4. This parameter is guaranteed by device characterization, but is not production tested.


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