150mA SOT-23 Ultra Low Noise CMOS RF-LDO™ Regulator

Impala Linear Corporation

9

(408) 574-3939

www.impalalinear.com

April 1999

ILC7082 1.3

GROUNDING RECOMMENDATIONS

“GROUND PLANE”.

“LOCAL GROUND” and not directly to the “GROUND PLANE”.

3. On multilayer boards use component side copper for

grounding around the ILC7082 and connect back to a

“GROUND PLANE” using vias.

4. If using a DC-DC converter in your design, use a star

grounding system with separate traces for the power

ground and the control signals. The star should radiate from

where the power supply enters the PCB.

LAYOUT CONSIDERATIONS

1. Place all RF LDO related components; ILC7082, input

3. The traces for the related components; ILC7082, input

to the LDO.

4. Maintain a separate “LOCAL GROUND” remote from the

“GROUND PLANE” to ensure a quiet ground near the LDO.

Figure 9 shows how this circuit can be translated into a

PCB layout.

Figure 9: Recommended application circuit layout ( not drawn to scale)

Note, ground plane is bottom layer of PCB and connects to top layer ground

connections through vias.

Pin Number

Pin Name

Manufacturer

Description

U1

ILC7082AIM5-30

Impala Linear

150mA RF LDO

J1

69190-405

Berg

Connector, four position header

Cin

GRM40 Y5V 105Z16

muRata

Ceramic capacitor, 1

Cnoise

ECU-V1H103KBV

Panasonic

Ceramic capacitor, 0.01

Cout

GRM42-6X5R475K10

muRata

Ceramic capacitor, 4.7

Figure 8: Recommended application circuit schematic.

Evaluation Board Parts List For Printed Circuit Board Shown Above