TNPW e3

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Vishay

Revision: 05-Feb-14

9

Document Number: 28758

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

4.23

Climatic

sequence:

± (0.1 % R + 0.02

)

4.23.2

2 (Bb)

Dry heat

UCT; 16 h

4.23.3

30 (Db)

Damp

55 °C; 24 h;

 90 % RH;

1 cycle

4.23.4

1 (Ab)

Cold

LCT; 2 h

4.23.5

13 (M)

Low air pressure

8.5 kPa; 2 h; 25 ± 10 °C

4.23.6

30 (Db)

Damp heat,

cyclic

55 °C; 5 days;

 90 % RH; 5 cycles

4.23.7

-

DC load

U =

 U

LCT = - 55 °C

UCT = 125 °C

-

1 (Ab)

Cold

- 55 °C; 2 h

± (0.05 % R + 0.01

)

4.19

14 (Na)

Rapid change

of temperature

30 min at LCT and 30 min at UCT;

LCT = - 55 °C; UCT = 125 °C;

1000 cycles

± (0.1 % R + 0.01

)

4.13

-

Short time

overload

U = 2.5 x

or

severe; 5 s

± (0.05 % R + 0.01

)

4.27

-

Single pulse

high voltage

overload

Severity no. 4:

U = 10 x

or

whichever is the less severe;

10 pulses 10 μs/700 μs

± (0.5 % R + 0.02

)

no visible damage

4.37

-

Periodic

electric

overload

U =

or

whichever is the less severe;

0.1 s on; 2.5 s off; 1000 cycles

± (0.5 % R + 0.05

)

no visible damage

4.22

6 (Fc)

Vibration

Endurance by sweeping;

10 Hz to 2000 Hz;

no resonance;

amplitude

 1.5 mm or

± (0.05 % R + 0.01

)

no visible damage

4.17.2

58 (Td)

Solderability

Solder bath method;

SnPb40; non-activated flux

(215 ± 3) °C; (3 ± 0.3) s

Good tinning (

 95 % covered);

no visible damage

Solder bath method;

SnAg3Cu0.5 or SnAg3.5;

non-activated flux

(235 ± 3) °C; (2 ± 0.2) s

4.18.2

58 (Td)

Resistance to

soldering heat

Solder bath method;

(260 ± 5) °C; (10 ± 1) s

± (0.02 % R + 0.01

)

4.29

45 (XA)

Component

solvent

resistance

Isopropyl alcohol + 50 °C; method 2

No visible damage

4.32

Shear

(adhesion)

RR 1005M and RR 1608M; 9 N

No visible damage

RR 2012M and RR 3216M: 45 N

4.33

Substrate

bending

Depth 2 mm, 3 times

± (0.05 % R + 0.01

)

no visible damage, no open circuit in bent position

4.7

-

Voltage proof

No flashover or breakdown

4.35

-

Flammability

IEC 60695-11-5,

needle flame test; 10 s

No burning after 30 s

--

Damp heat,

steady state

accelerated

(85 ± 5) °C; 56 days

(85 ± 5) % RH

± (0.25 R + 0.05

)

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1



CLAUSE

IEC 60068-2

TEST METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (

R)

Stability for product types:

TNPW0402 e3

TNPW0603 e3

TNPW0805 e3

TNPW1206 e3

TNPW1210 e3

P

P

P

15 x P