8

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate

and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which

may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site http://www.intersil.com

Sales Office Headquarters

NORTH AMERICA

Intersil Corporation

P. O. Box 883, Mail Stop 53-204

Melbourne, FL 32902

TEL: (407) 724-7000

FAX: (407) 724-7240

EUROPE

Intersil SA

Mercure Center

100, Rue de la Fusee

1130 Brussels, Belgium

TEL: (32) 2.724.2111

FAX: (32) 2.724.22.05

ASIA

Intersil (Taiwan) Ltd.

Taiwan Limited

7F-6, No. 101 Fu Hsing North Road

Taipei, Taiwan

Republic of China

TEL: (886) 2 2716 9310

FAX: (886) 2 2715 3029

ACTS00MS

Spec Number

518822

-D-

-C-

0.004

H A - B

M

D

S

S

-A-

-B-

0.036

H A - B

M

D

S

S

e

E

A

Q

L

D

A

E1

SEATING AND

L

E2

E3

E3

BASE PLANE

-H-

b

C

S1

M

c1

b1

(c)

(b)

SECTION A-A

BASE

LEAD FINISH

METAL

PIN NO. 1

ID AREA

A

M

14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.045

0.115

1.14

2.92

-

b

0.015

0.022

0.38

0.56

-

b1

0.015

0.019

0.38

0.48

-

c

0.004

0.009

0.10

0.23

-

c1

0.004

0.006

0.10

0.15

-

D

-

0.390

-

9.91

3

E

0.235

0.260

5.97

6.60

-

E1

-

0.290

-

7.11

3

E2

0.125

-

3.18

-

-

E3

0.030

-

0.76

-

7

e

0.050 BSC

1.27 BSC

-

k

0.008

0.015

0.20

0.38

2

L

0.270

0.370

6.86

9.40

-

Q

0.026

0.045

0.66

1.14

8

S1

0.005

-

0.13

-

6

M

-

0.0015

-

0.04

-

N14

14

-

Rev. 0 5/18/94

Ceramic Metal Seal Flatpack Packages (Flatpack)

NOTES:

1. Index area: A notch or a pin one identification mark shall be locat-

ed adjacent to pin one and shall be located within the shaded

area shown. The manufacturer’s identification shall not be used

as a pin one identification mark. Alternately, a tab (dimension k)

may be used to identify pin one.

2. If a pin one identification mark is used in addition to a tab, the lim-

its of dimension k do not apply.

3. This dimension allows for off-center lid, meniscus, and glass overrun.

4. Dimensions b1 and c1 apply to lead base metal only. Dimension

M applies to lead plating and finish thickness. The maximum lim-

its of lead dimensions b and c or M shall be measured at the cen-

troid of the finished lead surfaces, when solder dip or tin plate

lead finish is applied.

5. N is the maximum number of terminal positions.

6. Measure dimension S1 at all four corners.

7. For bottom-brazed lead packages, no organic or polymeric mate-

rials shall be molded to the bottom of the package to cover the

leads.

8. Dimension Q shall be measured at the point of exit (beyond the

meniscus) of the lead from the body. Dimension Q minimum

shall be reduced by 0.0015 inch (0.038mm) maximum when sol-

der dip lead finish is applied.

9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.

10. Controlling dimension: INCH.