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AD7891YS-2 Datasheet(PDF) 3 Page - Analog Devices |
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AD7891YS-2 Datasheet(HTML) 3 Page - Analog Devices |
3 / 20 page –3– REV. D AD7891 Parameter A Version 1 B Version Y Version Unit Test Conditions/Comments LOGIC OUTPUTS Output High Voltage, VOH 4.0 4.0 4.0 V min ISOURCE = 200 mA. Output Low Voltage, VOL 0.4 0.4 0.4 V max ISINK = 1.6 mA. DB11to DB0 Floating-State Leakage Current ±10 ±10 ±10 mA max Floating-State Capacitance 5 15 15 15 pF max Output Coding Straight (Natural) Binary Data format bit of control register = 0. Twos Complement Data format bit of control register = 1. CONVERSION RATE Conversion Time 1.6 1.6 1.6 ms max Track/Hold Acquisition Time 0.6 0.6 0.6 ms max AD7891-1 hardware conversion. 0.7 0.7 0.7 ms max AD7891-1 software conversion. 0.4 0.4 0.4 ms max AD7891-2. POWER REQUIREMENTS VDD 55 5 V nom ±5% for specified performance. IDD Normal Mode 20 20 21 mA max Standby Mode 80 80 80 mA max Logic inputs = 0 V or VDD. Power Dissipation VDD = 5 V. Normal Mode 100 100 105 mW max Typically 82 mW. Standby Mode 400 400 400 mW max Typically 75 mW. NOTES 1Temperature ranges for the A and B Versions: –40 ∞C to +85∞C. Temperature range for the Y Version: –55∞C to +105∞C. 2The AD7891-1’s dynamic performance (THD and SNR) and the AD7891-2’s THD are measured with an input frequency of 10 kHz. The AD7891-2’s SNR is evaluated with an input frequency of 100 kHz. 3This throughput rate can only be achieved when the part is operated in the parallel interface mode. Maximum achievable throughput rate in the serial interface mode is 357 kSPS. 4See the Terminology section. 5Sample tested during initial release and after any redesign or process change that may affect this parameter. 6REF IN must be buffered before being applied to V INXB. Specifications subject to change without notice. ABSOLUTE MAXIMUM RATINGS * (TA = 25 ∞C, unless otherwise noted) VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V Analog Input Voltage to AGND AD7891-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±17 V AD7891-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5 V, +10 V Reference Input Voltage to AGND . . . . –0.3 V to VDD + 0.3 V Digital Input Voltage to DGND . . . . . . –0.3 V to VDD + 0.3 V Digital Output Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V Operating Temperature Range Commercial (A, B Versions) . . . . . . . . . . . – 40 ∞C to +85∞C Automotive (Y Version) . . . . . . . . . . . . . . –55 ∞C to +105∞C Storage Temperature Range . . . . . . . . . . . . –65 ∞C to +150∞C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150 ∞C MQFP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 95∞C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215 ∞C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 ∞C PLCC Package, Power Dissipation . . . . . . . . . . . . . . 500 mW qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 55∞C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215 ∞C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 ∞C *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7891 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
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