427

HCTS20MS

Die Characteristics

DIE DIMENSIONS:

2.20 x 2.24(mm)

METALLIZATION:

Type: SiAl

Metal Thickness: 11k

Å

GLASSIVATION:

Thickness: 13k

Å

WORST CASE CURRENT DENSITY:

BOND PAD SIZE:

100

µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS20MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS20 is TA14426A.

A1

VCC

D2

B1 (2)

NC (3)

C1 (4)

D1 (5)

(6)

(7)

(8)

(9) A2

(10) B2

(11) NC

(12) C2

(1)

(14)

(13)

Y1

GND

Y2

Spec Number

518619