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HCTS20HMSR Datasheet(PDF) 8 Page - Intersil Corporation |
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HCTS20HMSR Datasheet(HTML) 8 Page - Intersil Corporation |
8 / 9 page 427 HCTS20MS Die Characteristics DIE DIMENSIONS: 2.20 x 2.24(mm) METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCTS20MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS20 is TA14426A. A1 VCC D2 B1 (2) NC (3) C1 (4) D1 (5) (6) (7) (8) (9) A2 (10) B2 (11) NC (12) C2 (1) (14) (13) Y1 GND Y2 Spec Number 518619 |
Similar Part No. - HCTS20HMSR |
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Similar Description - HCTS20HMSR |
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