Data Sheet G14607EJ4V0DS00

6

µµµµ PC1060

RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below.

If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to

consult with our sales offices.

For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (C10535E).

Type of Through-hole Device

µµµµ PC1060C : 8-pin plastic DIP (7.62 mm (300))

Process

Conditions

Wave soldering (only to leads)

Solder temperature: 260

°C or below, Flow time: 10 seconds or less.

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure

that the package body does not get jet soldered.

REFERENCE DOCUMENTS

Semiconductor Device Mounting Technology Manual

C10535E

Semiconductor Selection Guide -Products and Packages-

X13769X