AD8396

Rev. C | Page 11 of 12

OUTLINE DIMENSIONS

COMPLIANT

1

0.65

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

0.50

0.40

0.30

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

0.35

0.30

0.25

2.60

2.50 SQ

2.40

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 17. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm, Very Very Thin Quad

(CP-16-26)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD8396ACPZ-R21

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

CP-16-26

AD8396ACPZ-RL1

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

CP-16-26

AD8396ACPZ-R71

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

CP-16-26