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HCS05DMSR Datasheet(PDF) 8 Page - Intersil Corporation

Part # HCS05DMSR
Description  Radiation Hardened Triple 3-Input NAND Gate
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Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

HCS05DMSR Datasheet(HTML) 8 Page - Intersil Corporation

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HCS10MS
Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20mm x 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
Å
± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13k
Å
± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100
µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCS10MS
A1
VCC
C1
B1 (2)
A2 (3)
B2 (4)
C2 (5)
(6)
(7)
(8)
(9) A3
(10) B3
(11) C3
(12) Y1
(1)
(14)
(13)
Y2
GND
Y3
Spec Number
518747


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