AD9500_15 datasheet(5/11 Pages) AD

Part #	AD9500

Description	Digitally Programmable Delay Generator

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Manufacturer	AD [Analog Devices]

Direct Link	http://www.analog.com

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5 / 11 page

AD9500

–5–

REV. D

Figure 1. System Timing Diagram

MECHANICAL INFORMATION

Die Dimensions . . . . . . . . . . . . . . . 104

103

18 (max) mils

Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . 4

4 (min) mils

Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum

Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None

Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–VS

Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride

Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Gold Eutectic

Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding

or 1 mil, Gold; Gold Ball Bonding

DIE LAYOUT

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