9

HCTS08MS

Spec Number

518842

14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

-

0.200

-

5.08

-

b

0.014

0.026

0.36

0.66

2

b1

0.014

0.023

0.36

0.58

3

b2

0.045

0.065

1.14

1.65

-

b3

0.023

0.045

0.58

1.14

4

c

0.008

0.018

0.20

0.46

2

c1

0.008

0.015

0.20

0.38

3

D

-

0.785

-

19.94

-

E

0.220

0.310

5.59

7.87

-

e

0.100 BSC

2.54 BSC

-

eA

0.300 BSC

7.62 BSC

-

eA/2

0.150 BSC

3.81 BSC

-

L

0.125

0.200

3.18

5.08

-

Q

0.015

0.060

0.38

1.52

5

S1

0.005

-

0.13

-

6

S2

0.005

-

0.13

-

7

α

-

aaa

-

0.015

-

0.38

-

bbb

-

0.030

-

0.76

-

ccc

-

0.010

-

0.25

-

M

-

0.0015

-

0.038

2

N14

14

8

Rev. 0 4/94

NOTES:

1. Index area: A notch or a pin one identification mark shall be locat-

ed adjacent to pin one and shall be located within the shaded

area shown. The manufacturer’s identification shall not be used

as a pin one identification mark.

2. The maximum limits of lead dimensions b and c or M shall be

measured at the centroid of the finished lead surfaces, when

solder dip or tin plate lead finish is applied.

3. Dimensions b1 and c1 apply to lead base metal only. Dimension

M applies to lead plating and finish thickness.

4. Corner leads (1, N, N/2, and N/2+1) may be configured with a

partial lead paddle. For this configuration dimension b3 replaces

dimension b2.

5. Dimension Q shall be measured from the seating plane to the

base plane.

6. Measure dimension S1 at all four corners.

7. Measure dimension S2 from the top of the ceramic body to the

nearest metallization or lead.

8. N is the maximum number of terminal positions.

9. Braze fillets shall be concave.

10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.

11. Controlling dimension: INCH.

bbb

C A - B

S

c

Q

L

A

SEATING

BASE

D

PLANE

PLANE

S

S

-D-

-A-

-C-

-B-

aaa

C A - B

M

D

S

S

ccc

C A - B

M

D

S

S

D

E

S1

b2

b

A

e

M

c1

b1

(c)

(b)

SECTION A-A

BASE

LEAD FINISH

METAL

S2

M

A

Packaging

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate

and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which

may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site http://www.intersil.com

Sales Office Headquarters

NORTH AMERICA

Intersil Corporation

P. O. Box 883, Mail Stop 53-204

Melbourne, FL 32902

TEL: (407) 724-7000

FAX: (407) 724-7240

EUROPE

Intersil SA

Mercure Center

100, Rue de la Fusee

1130 Brussels, Belgium

TEL: (32) 2.724.2111

FAX: (32) 2.724.22.05

ASIA

Intersil (Taiwan) Ltd.

Taiwan Limited

7F-6, No. 101 Fu Hsing North Road

Taipei, Taiwan

Republic of China

TEL: (886) 2 2716 9310

FAX: (886) 2 2715 3029