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HCTS147D Datasheet(PDF) 9 Page - Intersil Corporation |
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HCTS147D Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 10 page 538 HCTS147MS Die Characteristics DIE DIMENSIONS: 85 x 101 mils METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCTS147MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS147 is TA14482A. I4 (1) I5 (2) I6 (3) I7 (4) I8 (5) Y2 (6) Y1 (7) GND (8) Y0 (9) (12) I2 (13) I3 (14) Y3 VCC (11) I8 (16) NC (15) I9 (10) Spec Number 518608 |
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