HCTS193MS datasheet(9/9 Pages) INTERSIL

Part #	HCTS193MS

Description	Radiation Hardened Synchronous 4-Bit Up/Down Counter

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Manufacturer	INTERSIL [Intersil Corporation]

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HCTS193MS

Die Characteristics

DIE DIMENSIONS:

104 x 86 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å

± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å

± 2.6kÅ

WORST CASE CURRENT DENSITY:

< 2.0 x 105A/cm2

BOND PAD SIZE:

100

µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS193MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS193 is TA14451A.

P1

(1)

Q1

(2)

Q0(3)

GND

(8)

P3

(9)

(15) P0

VCC

(16)

P2

(10)

CPD(4)

CPU(5)

Q2(6)

Q3(7)

(14) MR

(13) TCD

(12) TCU

(11) PL

Spec Number

518620

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Renesas Technology Corp	HCTS193MS	485Kb / 9P	Radiation Hardened Synchronous 4-Bit Up/Down Counter September 1995

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HCTS193MS Datasheet(PDF) 9 Page - Intersil Corporation

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