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HIP6503CB Datasheet(PDF) 10 Page - Intersil Corporation |
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HIP6503CB Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 14 page 10 In HIP6503 applications, loss of any one active ATX output (3.3VIN,5VIN, or 12VIN; as detected by the on-board voltage monitors) during active state operation causes the chip to switch to S5 sleep state, in addition to reporting the input UV condition on the FAULT/MSEL pin. Exiting from this forced- S5 state can only be achieved by returning the faulting input voltage above its UV threshold, by resetting the chip through removal of 5VSB bias voltage, or by bringing the SS pin at a potential lower than 0.8V. Output Voltages The output voltages are internally set and do not require any external components. Selection of the VMEM memory voltage is done by means of an external resistor connected between the FAULT/MSEL pin and ground. An internal 40 µA (typical) current source creates a voltage drop across this resistor. Following every 3.3VSB ramp-up or chip reset (see Soft-Start Circuit), this voltage is compared with an internal reference and the setting is latched in. Based on this comparison, the output voltage is set at either 2.5V (RSEL =1kΩ), or 3.3V (RSEL = 10kΩ). It is very important that no capacitor is connected to the FAULT/MSEL pin; the presence of a capacitive element at this pin can lead to false memory voltage selection. See Figure 9 for details. Application Guidelines Soft-Start Interval The 5VSB output of a typical ATX supply is capable of 725mA. During power-up in a sleep state, it needs to provide sufficient current to charge up all the output capacitors and simultaneously provide some amount of current to the output loads. Drawing excessive amounts of current from the 5VSB output of the ATX can lead to voltage collapse and induce a pattern of consecutive restarts with unknown effects on the system’s behavior or health. The built-in soft-start circuitry allows tight control of the slew- up speed of the output voltages controlled by the HIP6503, thus enabling power-ups free of supply drop-off events. Since the outputs are ramped up in a linear fashion, the current dedicated to charging the output capacitors can be calculated with the following formula: , where ISS - soft-start current (typically 10µA) CSS - soft-start capacitor VBG - bandgap voltage (typically 1.26V) Σ(C OUT x VOUT) - sum of the products between the capacitance and the voltage of an output (total charge delivered to all outputs) Due to the various system timing events, it is recommended that the soft-start interval not be set to exceed 30ms. Shutdown In case of a FAULT condition that might endanger the computer system, or at any other time, all the HIP6503 outputs can be shut down by pulling the SS pin below the specified shutdown level (typically 0.8V) with an open drain or open collector device capable of sinking a minimum of 2mA. Pulling the SS pin low effectively shuts down all the pass elements. Upon release of the SS pin, the HIP6503 undergoes a new soft-start cycle and resumes normal operation in accordance to the ATX supply and control pins status. Layout Considerations The typical application employing a HIP6503 is a fairly straight forward implementation. Like with any other linear regulator, attention has to be paid to the few potentially sensitive small signal components, such as those connected to sensitive nodes or those supplying critical by-pass current. The power components (pass transistors) and the controller IC should be placed first. The controller should be placed in a central position on the motherboard, closer to the memory load if possible, but not excessively far from the clock chip or the processor. Insure the 1V8SB, DRV2 and VSEN2 connections are properly sized to carry 250mA without significant resistive losses; similar guideline applies to the VCLK output, which can deliver as much as 800mA (typical). As the current for the VCLK output is provided from the ATX 3.3V, the connection from the 3V3 pin to the 3.3V plane should be sized to carry the maximum clock output current while exhibiting negligible voltage losses. Similarly, the 5VSB and the 5V pins are carrying significant levels of current - for best results, insure they are connected to their respective sources through adequately sized traces. The pass transistors should be placed on pads capable of heatsinking matching the device’s power dissipation. Where applicable, multiple via connections to a large internal plane can significantly lower localized device temperature rise. Placement of the decoupling and bulk capacitors should follow a placement reflecting their purpose. As such, the FIGURE 9. 2.5/3.3VMEM OUTPUT VOLTAGE SELECTION CIRCUITRY DETAILS FAULT/MSEL 40 µA + - + - 0.2V MEM VOLTAGE SELECT COMP RSEL RSEL VMEM 1k Ω 10k Ω 2.5V 3.3V 5VSB I COUT I SS C SS V BG × ------------------------------ Σ C OUT V OUT × () × = HIP6503 |
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