ADG774

–4–

REV. C

ORDERING GUIDE

Model

Temperature Range

Package Descriptions

Package Options

ADG774BR

–40

°C to +125°C

Standard Small Outline Package (SOIC)

R-16

ADG774BR-REEL

–40

°C to +125°C

Standard Small Outline Package (SOIC)

R-16

ADG774BR-REEL7

–40

°C to +125°C

Standard Small Outline Package (SOIC)

R-16

ADG774BRZ

*

–40

°C to +125°C

Standard Small Outline Package (SOIC)

R-16

ADG774BRZ-REEL

*

–40

°C to +125°C

Standard Small Outline Package (SOIC)

R-16

ADG774BRZ-REEL7

*

–40

°C to +125°C

Standard Small Outline Package (SOIC)

R-16

ADG774BRQ

–40

°C to +125°C

Shrink Small Outline Package (QSOP)

RQ-16

ADG774BRQ-REEL

–40

°C to +125°C

Shrink Small Outline Package (QSOP)

RQ-16

ADG774BRQ-REEL7

–40

°C to +125°C

Shrink Small Outline Package (QSOP)

RQ-16

ADG774BRQZ

*

–40

°C to +125°C

Shrink Small Outline Package (QSOP)

RQ-16

ADG774BRQZ-REEL

*

–40

°C to +125°C

Shrink Small Outline Package (QSOP)

RQ-16

ADG774BRQZ-REEL7

*

–40

°C to +125°C

Shrink Small Outline Package (QSOP)

RQ-16

*Z = Pb-free part.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the ADG774 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

ABSOLUTE MAXIMUM RATINGS

1

°C unless otherwise noted.)

Analog, Digital Inputs

2

30 mA, Whichever Occurs First

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 300 mA

(Pulsed at 1 ms, 10% Duty Cycle max)

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW

. . . . . . . . . . . . . . . . . . . . . 100

°C/W

QSOP Package, Power Dissipation . . . . . . . . . . . . . . . 566 mW

. . . . . . . . . . . . . . . . . . . 149.97

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300

°C

I R Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235

°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

limited to the maximum ratings given.