HS9-6617RH-Q datasheet(10/14 Pages) INTERSIL

Part #	HS9-6617RH-Q

Description	Radiation Hardened 2K x 8 CMOS PROM

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Manufacturer	INTERSIL [Intersil Corporation]

Direct Link	http://www.intersil.com/cda/home

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10

HS-6617RH

Metallization Topology

DIE DIMENSIONS:

164 x 250 x 19

±1mils

METALLIZATION:

Type: Silicon-Aluminum

Thickness: 13k

Å

± 2kÅ

GLASSIVATION:

Type: SiO2

Thickness: 8k

Å

± 1kÅ

WORST CASE CURRENT DENSITY:

1 x 105 A/cm2

SUBSTRATE POTENTIAL: VDD

Metallization Mask Layout

HS-6617RH

A2 (6)

A1 (7)

A0 (8)

(20) G

(19) A10

(18) E

Spec Number

518742

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Intersil Corporation	HS9-6617RH-Q	139Kb / 5P	Radiation Hardened 2K x 8 CMOS PROM

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