ADN2880

Rev. 0 | Page 5 of 12

PAD LAYOUT AND FUNCTION DESCRIPTIONS

2

3

4

5

678

9

11

12

1

13

14

15

16

17

GND

IN

TEST

FILTER

FILTER

GND

OUTB

OUT

GND

10

GND

CAP

RSSI

GND

VCC

VCC

VCCFILTER

GND

Figure 2. Pad Layout

Table 3. Pad Function Descriptions

Pad No.

Mnemonic

Pin Type1

Description

1

GND

P

Ground. (Input return.)

2

IN

AI

Current Input. Bond directly to a photodiode (PD) anode.

3

TEST

AI

Test Probe Pad. Do not connect.

4, 5

FILTER

AO

Filter Output. Pad 4 and Pad 5 are metal connected. Optional bond to a PD cathode.

6

GND

P

Ground.

7

RSSI

AO

Voltage Output. Provides average input current monitoring. If not used, connect to ground.

8

CAP

AI

Low Frequency Cutoff (LFC) Setpoint. For SONET applications, see Figure 10 and contact sales

for assembly details.

9, 10, 13, 14

GND

P

Ground. (Output return.)

11

OUTB

AO

Negative Output, CML, On-Chip 50 Ω Termination (AC or DC Termination).

12

OUT

AO

Positive Output, CML, On-Chip 50 Ω Termination (AC or DC Termination).

15

VCCFILTER

P

On-Chip Filter Supply. Connect to VCC to Enable On-Chip RC Filter (200 Ω, 20 pF). Leave

unconnected if not used.

16, 17

VCC

P

3.3 V Supply. Place a 200 pF, RF decoupling capacitor close to the power pad to reduce

the power noise.