6

Thermal Resistance vs. Mounting Pad Area

resistance of the heat dissipating path determines the maximum

represents the relationship and serves as the basis for

establishing the rating of the part.

In using surface mount devices such as the TSOP-6

package, the environment in which it is applied will have a

significant influence on the part’s current and maximum

complex and influenced by many factors:

1. Mounting pad area onto which the device is attached and

whether there is copper on one side or both sides of the

board.

2. The number of copper layers and the thickness of the board.

3. The use of external heat sinks.

4. The use of thermal vias.

5. Air flow and board orientation.

6. For non steady state applications, the pulse width, the duty

cycle and the transient thermal response of the part, the

board and the environment they are in.

Intersil provides thermal information to assist the designer’s

for the device as a function of the top copper (component

side) area. This is for a horizontally positioned FR-4 board

with 1oz copper after 1000 seconds of steady state power

Test Circuits and Waveforms

FIGURE 16. GATE CHARGE TEST CIRCUIT

FIGURE 17. GATE CHARGE WAVEFORMS

FIGURE 18. SWITCHING TIME TEST CIRCUIT

FIGURE 19. SWITCHING TIME WAVEFORM

+

-

DUT

0

0

0V

DUT

+

-

90%

10%

90%

10%

90%

50%

50%

10%

PULSE WIDTH

0

0

(EQ. 1)

P

DM

T

JM

T

A

–

()

ZθJA

-------------------------------

=

ITF87012SVT