IRG4BC30K-S

8

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1 0 .16 ( .4 0 0 )

R E F .

6.47 ( .2 5 5 )

6.18 ( .2 4 3 )

2.61 ( .1 0 3 )

2.32 ( .0 9 1 )

8.8 9 ( .3 5 0 )

R E F .

- B -

1.32 (.0 5 2 )

1.22 (.0 4 8 )

2.79 (.1 1 0 )

2.29 (.0 9 0 )

1 .39 ( .055 )

1 .14 ( .045 )

5 .28 ( .2 0 8 )

4 .78 ( .1 8 8 )

4.69 (.1 8 5 )

4.20 (.1 6 5 )

10.5 4 (.4 1 5 )

10.2 9 (.4 0 5 )

- A -

2

1

3

15 .4 9 (.6 1 0 )

14 .7 3 (.5 8 0 )

3X

0.9 3 ( .0 3 7 )

0.6 9 ( .0 2 7 )

5.08 ( .2 0 0 )

3X

1.40 (.0 5 5 )

1.14 (.0 4 5 )

1.78 (.0 7 0 )

1.27 (.0 5 0 )

1.40 (.055 )

M A X .

NO T E S:

1 D IM E N S IO N S A F T E R S O L D E R D IP .

2 DIM E NSIO NIN G & T O L E R A NCING PE R A N S I Y1 4 .5 M , 1 9 8 2 .

3 C O N T R O L L IN G D IM E N S IO N : IN C H .

4 HE A T S IN K & L E A D DIM E NSIO NS D O NO T IN CL U D E B U RRS .

0.55 ( .0 2 2 )

0.46 ( .0 1 8 )

0.25 ( .0 1 0 )

M

B A M

MIN IMU M R E C O MM E N D E D F O O T P R IN T

11 .43 (.4 5 0 )

8.89 ( .3 5 0 )

17.7 8 ( .7 0 0 )

3.81 ( .150 )

2.0 8 ( .082 )

2 X

L E AD AS SIG N M E NT S

1 - G A T E

2 - D R A IN

3 - S O U R C E

2.5 4 (.1 0 0 )

2 X

Notes:

max. junction temperature. ( See fig. 13b )

(See fig. 13a)

junction temperature.

For recommended footprint and soldering techniques refer

to application note #AN-994.

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Data and specifications subject to change without notice. 10/00