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TGA1073B-SCC Datasheet(PDF) 6 Page - TriQuint Semiconductor |
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TGA1073B-SCC Datasheet(HTML) 6 Page - TriQuint Semiconductor |
6 / 7 page TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com Product Datasheet 6 Chip Assembly and Bonding Diagram Recommended: Solder MMIC to carrier using AuSn 80/20 Bond MMIC RF in and RF out with 5mil Au ribbon Ribbon should be as short as possible Bond DC Lines as shown with 1 mil bondwires 0.01uF 0.01uF 100pF 100pF TGA1073B-SCC Vg Vd RF in RF out |
Similar Part No. - TGA1073B-SCC |
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Similar Description - TGA1073B-SCC |
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