TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com

Product Data Sheet

December 3, 2009

10

Chip Assembly & Bonding Diagram

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

100pF

Vg

Input TFN

Output TFN

100pF

Vd

Off chip

R=10

Ω

Off chip

C=0.1

μF

Off chip

R=10

Ω

Off chip

C=0.1

μF

TGA2510