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TGA2526

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

January 2014 Rev A

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

Mechanical Drawing

Units: millimeters

Thickness: 0.10

Die x,y size tolerance: +/ - 0.050

Chip edge to bond pad dimensions are shown to center of pad

Ground is backside of die

Bond Pad # 1

RF In

0.100 x 0.158

Bond Pad # 4

Vd1

0.110 x 0.135

Bond Pad # 2

Vg2

0.100 x 0.100

Bond Pad # 5

RF Out

0.100 x 0.158

Bond Pad # 3

Vd2

(Not used)

0.135 x 0.110

Bond Pad # 6

Vg1

0.100 x 0.100